PRO3D: Programming for Future 3D Manycore Architectures

Christian Fabre, Iuliana Bacivarov, Lothar Thiele, Hoeseok Yang, Pratyush Kumar, Devesh Chokshi, Ahmed Jerraya, Julien Mottin, Jean-Pierre Krimm, Ananda Basu, Saddek Bensalem, Marius Bozga, Paraskevas Bourgos, Martino Ruggiero, Luca Benini, Andrea Marongiu, Eric Flamand and Diego Melpignano.
Proceeddings of the 6th Workshop on Interconnection Network Architecture: On-Chip, Multi-Chip (INA-OCMC 2012).
PRO3D tackles two 3D technologies and their consequences on stacked architectures and software stack: through silicon vias (TSV) and liquid cooling. 3D memory hierarchies and the thermal impact of software on the 3D stack are mainly explored. The PRO3D software development flow is based on a rigorous assembly of software components and monitors the thermal integrity of the 3D stack. PRO3D experiments are mainly targeted on P2012, an industrial embedded manycore platform developped by STMicroelectronics.
DOI: 10.1145/2107763.2107776