From 3D Opportunities to 3D Manycore Architecture

WP1 will develop a flexible virtual platform infrastructure (VPI) for modelling and analysis of 3D integrated architectures and memory systems. This VPI development process will entail the definition of parametric models of the main micro-architectural components of a 3D integrated interconnect and memory hierarchy, as well as supporting modular plugins for interfacing with thermal and power models, developed in WP3.
WP1 will define and characterize (electrically and thermally) a 3D integration process flow that combines TSV and microchannels fabrication for liquid cooling of multiple tiers. The final outcome of this work package is the development of high-level technology models of complete 3D stacks, which can be used to validate the effects of the cooling methods while executing benchmarks in the VPI, developed in WP1.