PRO3D, Programming for Future 3D Manycore Architectures: Project Interim Status

Christian Fabre, Iuliana Bacivarov, Ananda Basu, Martino Ruggiero, David Atienza, Eric Flamand, Jean-Pierre Krimm, Julien Mottin, Lars Schor, Pratyush Kumar, Hoeseok Yang, Devesh B. Chokshi, Lothar Thiele, Saddek Bensalem, Marius Bozga, Luca Benini, Mohamed M. Sabry, Yusuf Leblebici, Giovanni De Micheli, and Diego Melpignano.
In Formal Methods for Components and Objects, 10th International Symposium FMCO 2011. State-of-the-Art Survey. Bernhard Beckert, Ferruccio Damiani, Frank de Boer, and Marcello Bonsangue, editors. volume 7542 of LNCS. Springer, 2013.
PRO3D tackles two important 3D technologies, that are Through Silicon Via (TSV) and liquid cooling, and investigates their consequences on stacked architectures and entire software development. In particular, memory hierarchies are being revisited and the thermal impact of software on the 3D stack is explored. As a key result, a software design flow based on the rigorous assembly of software components and monitoring of the thermal integrity of the 3D stack has been developed. After 30 months of research, PRO3D proposes a complete tool-chain for 3D manycore, that integrates state-of-the-art tools ranging from system-level formal specifi cation and 3D exploration, to actual programming and runtime control on the 3D system. Current eforts are directed towards extensive experiments on an industrial embedded manycore platform.